CAMM has been around for years at this point and I’ve only seen them in a couple devices so, no, I don’t think so. They still can’t match the speed of solder either.
The Framework CEO said in a QA that AMD engineers did a simulation of this APU with CAMM and that they’d have to cut the memory bandwidth by half to make it work.
I wonder if CAMM modules will ever take off, I’ve always been told the reason soldered memory exists was to cut down on latency.
now I know that’s probably bullshit to some extent and more away to sell people on the higher tier SKUs
but I know moving off of existing technologies carries cost that companies might not want to bear
CAMM has been around for years at this point and I’ve only seen them in a couple devices so, no, I don’t think so. They still can’t match the speed of solder either.
The Framework CEO said in a QA that AMD engineers did a simulation of this APU with CAMM and that they’d have to cut the memory bandwidth by half to make it work.